High-Efficiency Compact Miniaturized Energy Harvesting And Storage Device

ABSTRACT

An energy harvesting and storage system includes an array of piezoelectric electrodes, in which the piezoelectric electrodes generate electrical energy from mechanical displacements of the piezoelectric electrodes; and an array of capacitor electrodes disposed in proximity to the piezoelectric electrodes, in which the array of capacitor electrodes stores a portion of the energy generated by the piezoelectric electrodes. An energy system includes a substrate including an array of micro-post electrodes connected to a cathode layer of the substrate; an isolation material covering the array of micro-post electrodes; and an anode layer including electrodes filling the remaining region between the isolation material-covered micro-post electrodes, in which the anode layer, electrodes, isolation material, micro-post electrodes, and substrate are monolithically coupled.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/187,235, filed Jun. 15, 2009, which is incorporated by reference.

BACKGROUND

The present disclosure generally relates to electrical power suppliesand, more particularly, to miniaturized energy harvesting and storage.

Conventional electro-chemical batteries are often used in poweringsensor electronics, for example, in components for wirelesscommunication. Their finite power capacity thus may become a majorlimitation in deploying sensor electronics with conventional batteriesin the field for prolonged unattended operations. Therefore, there hasbeen an increasing demand for harvesting electrical energy from ambientvibrations in the surrounding environment using electromechanicaltransducers based on electromagnetic, electrostatic, or piezoelectriceffects. Among these transducers, piezoelectric power generators are themost applicable to miniaturized sensors because of their great potentialin achieving high power densities using novel nano-scale materials andstructures. The current technology is limited to a handful ofnanostructures made of piezoelectric materials such as ZnO (zinc oxide)with potential output power densities of about 80 milliwatts per squaremeter (mW/m²). Requirements for future systems may dictate higher powerdensities beyond these values for powering miniaturized (e.g., having avolume less than one cubic millimeter) sensors.

SUMMARY

According to one embodiment, an energy harvesting system includes anarray of piezoelectric electrodes, in which the piezoelectric electrodesgenerate electrical energy from mechanical displacements of thepiezoelectric electrodes; and an array of capacitor electrodesinterspersed with the piezoelectric electrodes, in which the array ofcapacitor electrodes stores a portion of the energy generated by thepiezoelectric electrodes.

According to another embodiment, an energy system includes a substrateincluding an array of micro-post electrodes connected to a cathode layerof the substrate; an isolation material covering the array of micro-postelectrodes; and an anode layer including electrodes filling theremaining region between the isolation material-covered micro-postelectrodes, in which the anode layer, electrodes, isolation material,micro-post electrodes, and substrate are monolithically coupled.

According to still another embodiment, a method includespiezoelectrically converting mechanical strain energy from an inducedmechanical stress on an array of piezoelectric electrode posts intoelectrical energy; and using a geometrical arrangement of an array ofcapacitor electrode posts and the array of piezoelectric electrode poststo capacitively store the electrical energy in the array of capacitorelectrode posts.

According to yet another embodiment, a method of manufacturing an energygeneration and storage device includes: forming an array of siliconposts on a substrate; making an elastomeric mold of the array of siliconposts having wells corresponding to the posts; casting an array ofpiezoelectric electrode posts from the mold; orienting the array ofpiezoelectric electrode posts so as to be interdigitally aligned withthe array of silicon posts; and disposing the array of piezoelectricelectrode posts and the array of silicon posts so as to beinterdigitally arranged with each other.

According to another embodiment, a method of manufacturing an energygeneration and storage device includes: etching an array of posts in asilicon substrate using reactive ion etching process; implanting andannealing the silicon substrate to form a cathode layer; forming one ofeither a piezoelectric or a dielectric layer on the array of posts; anddepositing a layer of doped polysilicon on the array of posts to form ananode layer.

The scope of the invention is defined by the claims, which areincorporated into this section by reference. A more completeunderstanding of embodiments of the invention will be afforded to thoseskilled in the art, as well as a realization of additional advantagesthereof, by a consideration of the following detailed description of oneor more embodiments. Reference will be made to the appended sheets ofdrawings that will first be described briefly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective diagram illustrating an energy harvesting andstorage system in accordance with one embodiment;

FIG. 2 is a cross sectional diagram illustrating an energy harvestingand storage system in accordance with another embodiment;

FIG. 3 is a geometrical diagram illustrating a pair of posts inaccordance with an embodiment;

FIG. 4 is a set of schematic three-dimensional renderings of variousdeformations of an array of posts in accordance with one or moreembodiments;

FIG. 5 is a scanning electron microscope (SEM) image of a nanostructuredsurface of a material, such as an array of posts in accordance with oneor more embodiments, with an inset showing an energy dispersivespectroscopy (EDS) spectrum of the material;

FIG. 6 is a graph showing examples of total number of electrodes in aone square millimeter area as a function of pitch (distance betweenelectrodes) for three different sizes of electrodes in accordance withone or more embodiments;

FIG. 7 is a graph showing examples of output voltage for electrodes as afunction of pitch (distance between electrodes) for three differentsizes of electrodes in accordance with one or more embodiments;

FIG. 8 is a graph showing examples of total capacitance for a one squaremillimeter array of electrodes as a function of pitch (distance betweenelectrodes) for three different sizes of electrodes in accordance withone or more embodiments;

FIGS. 9A, 9B, and 9C are perspective illustrations depicting threeexamples of electrode arrays, in accordance with one or moreembodiments, for which radius-to-separation ratios vary, affectingcapacitance values of the three electrode arrays;

FIGS. 10A, 10B, 10C, 10D are perspective illustrations corresponding tosteps in a manufacturing process for an energy harvesting and storagesystem in accordance with an embodiment; and

FIGS. 11A, 11B, 11C, 11D are perspective illustrations corresponding tosteps in a manufacturing process for an energy harvesting and storagesystem in accordance with another embodiment.

Embodiments and their advantages are best understood by referring to thedetailed description that follows. Like reference numerals are used toidentify like elements illustrated in one or more of the figures.

DETAILED DESCRIPTION

In accordance with one or more embodiments of the present invention,systems and methods disclosed herein provide a technical feasibility totake advantage of advances in nanofabrication technologies to developcomplementary units of electrical generator and storage chips built in acompatible Si manufacturing process. Advanced flexible and curablematerials may be used to produce highly efficientmechanical-to-electrical power coupling through the optimization ofphysical and geometrical configurations to yield power densities withtwo orders of magnitude higher energy than prior art technologies. Inone embodiment a system may include miniaturized (e.g., volume less than1 mm³) sensors equipped with electronics components for wireless datatransmission. Furthermore, the components in accordance with one or moreembodiments may be used in scenarios in the field. For example, suchcomponents may be mounted on unmanned aerial vehicles (UAV) or unmannedground vehicles (UGV) in extreme environments.

Embodiments provide a highly integrated and sensitive pressure sensorand storage unit that can convert impacts or motion (acceleration) toelectrical signals and after rectification deliver the electrical energyto a large capacitor acting as a battery for the source of energy. Afully integrated system with the highest energy generation and storagemay be achieved using an ionizable material in a cathode layer of thecapacitor. The battery-less power supply unit has an excellentapplication for powering wireless devices that can be used for trackingor remote monitoring of traffic heavy communications environments. Theintegral energy harvesting-storing unit can be easily serially chainedsuch that more energy can be harvested. Due to the simple nature ofmanufacturing the array posts, multiple energy conversion units such asoptical-electrical (photo voltaic), kinetics-electrical (MEM baseddevices), and radiation-electrical (plasma) transducers can be chainedin parallel from ground to space applications.

FIG. 1 illustrates an energy harvesting and storage system 100 accordingto one or more embodiments. System 100 may include an array ofpiezoelectric high aspect ratio electrode posts 102 (lighter gray inFIG. 1) and an array of capacitive high aspect ratio electrode posts 104(darker gray in FIG. 1). Array of piezoelectric high aspect ratioelectrode posts 102 may be formed from or attached to a substrate 106.Array of capacitive high aspect ratio electrode posts 104 may be formedfrom or attached to a substrate 108. The substrates 106, 108 and arrays102, 104 may be arranged interspersed with each other as shown in FIGS.1 and 2. The arrays 102, 104 may be arranged interdigitally with eachother, e.g., posts 102 (light gray) in-between and alternating withposts 104 (dark gray), which are also in-between and alternating withposts 102, as shown in FIG. 1. System 100 (and system 200 shown in FIG.2) may employ a two-step integration of using a piezoelectric array(e.g., array of electrodes 102) to generate the desired energy and asecond array of silicon micro-posts (e.g., array of electrodes 104) as ahighly capacitive load to store the generated energy.

FIG. 2 illustrates an example of an energy harvesting and storage system200 according to another embodiment. System 200 may include an array ofhigh aspect ratio electrode posts 202. Isolation material 212 may be apiezoelectric material—such as lead zirconate titanate (PZT)—for anenergy generator, e.g., array of piezoelectric electrodes 202; orisolation material 212 may be a high dielectric material—such astantalum oxide (Ta₂O₅)—for an energy storage device, e.g., array ofcapacitive electrodes 202. Accordingly, the choice of isolation material212 enables the arrangement of the arrays of posts 202 to act either asenergy generation or energy storage systems.

System 200 may include a cathode layer 207 electrically connecting thearray of electrodes 202. For example, the substrate 206 may includesilicon implanted by a high dose of arsenic and annealed to form acontinuous cathode layer 207. In an alternative embodiment, cathodelayer 207 may include a metallic layer or lower plate 2071, for example,of gold or aluminum, that forms a cathode. In another embodiment,cathode layer 207 may include an ionizable material. Such a material maybe formed, for example, using an acidic liquid similar to the process ofconstructing car batteries, to form an ionizable aqueous cathode layer207. Also, for example, cathode layer 207 may include a polarizablepolymer. Higher energy generation and storage may be achieved using suchan ionizable material for substrate 206 or cathode layer 207 in a fullyintegrated system 200.

System 200 may include an anode layer 208 electrically connecting theelectrodes 204. Electrodes 204 may be an array of posts 204 interspersedor interdigitally arranged with posts 202, for example, or may beelectrode material either connecting to or integral with anode layer 208and filling the region between posts 202 (e.g., the region remainingafter posts 202 are covered by isolation material 212). In the exampleof electrodes 204 filling the space between posts 202, the interdigitalpost separation (or gap between posts defined below with reference toFIG. 7 and equation (3)) is effectively reduced to zero. Thus, the anodelayer 208, including electrodes 204 may be monolithically coupled to anionizable aqueous layer 206. Anode layer 208 may exert pressure (e.g.,by transmitting vibrations from the ambient environment of system 200)on piezoelectric material 212 (e.g., PZT) as part of the energygenerating function of system 200.

FIG. 3 illustrates geometrical parameters for a pair of posts, such aselectrode posts 102, 104, 202, or 204. The parameters may affect theelectrical and mechanical properties of the arrays of electrode posts102, 104, 202, and 204. As seen in FIG. 3, L represents the length orheight of the posts; r represents the radius of the posts; and 2 drepresents the distance of separation between pairs of posts of anarray; this separation distance 2 d may also be referred to as the“pitch”. L/2 r may be defined as the aspect ratio of the electrodeposts; the aspect ratio of the posts may be defined as being “high” tothe extent that L>2 r.

FIG. 4 illustrates various deformations of an array of posts, e.g.,arrays of electrode posts 102, 104, 202, or 204, that may be useful formicro-fabricated substrates in an elastomeric polymer,polydimethylsiloxane (PDMS). PDMS may be built by using an array ofsilicon (Si) electrode posts to provide a replica of the array and beused to act as the mold to build the motion sensitive power generatingsensor (e.g., comprising array of piezoelectric posts 102). Theunmodified mold (center) can, for example, be: A) compressed along the[100] direction, B) stretched along the [100] direction, C) stretchedalong the [110] direction, D) uniformly concavely curved, E) torsionedaround the [001] axis, F) compressed along the [001] direction, G)sheared along the [100] direction, or H) uniformly curved convexly. Forexample, the mold may be subjected to one or more of the deformations Athrough H, shown in FIG. 4, while the array of posts (e.g., array ofpiezoelectric posts 102) is being fabricated using the deformed mold toarrive at an array of posts exhibiting the chosen deformation.

FIG. 5 illustrates an initial array of high aspect ratio posts 101formed from a silicon substrate 105 (from which, e.g., arrays of posts102 or 104 may be replicated on substrates 106, 108, respectively, orwhich may be used directly for, e.g., array of capacitive posts 104).The initial substrate 105 with high-aspect-ratio posts 101 can beformed, for example, using standard lithographical techniques, grownbottom-up (e.g., nano-wires), or using a biological sample. In oneembodiment, arrays of Si micro-posts (micro-electrodes) may be formedwith a pitch 2 d (distance between the posts), a post radius of r, and alength L (see FIG. 3). The array of posts 101 may serve multiplepurposes. The array may be used to create a mold that piezoelectricmaterial can be poured in, cured, and used to generate electricity uponexertion of force or motion on the system. Additionally, the array of Siposts may be used to be placed in parallel and adjacent to a flippedarray with significant storage capability, e.g., for capacitive storageof electrical energy. This combination of power generation and storageprovides an ideal power capability for a vast spectrum of remotelyconnected wireless networks of sensor clusters.

Mechanical stability of the structures expected to be formed usingmicro-posts with high aspect ratio (e.g., arrays of posts 101, 102, 104,202, 204) should be considered. There are several factors that can leadto the collapse of micro-posts: collapse due to weight, due to adhesionforces between the posts and the base surface, and due to lateraladhesion between the posts. Calculations show that the first two factorsmay be considered to be insignificant to affect the arrays 101, 102,104, 202, 204; even though the importance of the second factor increaseswith the fabrication of tilted nanostructures (see, e.g., FIG. 4G). Thelateral adhesion force is the strongest of the three, and should betaken into account. The critical aspect ratio, below which there will beno lateral collapse, is given by:

L/2r=(0.57E ^(1/3)(2d)^(1/2))/(γ_(s) ^(1/3)(2r)^(1/6)(1−v²)^(1/12))  Eq. (1)

where L is the height of the post, r is the radius of the post, d is thehalf pitch (separation distance=2 d) between posts, γ_(s) is the surfaceenergy, v is the Poisson ratio of the post material, and E is anextendability factor of the post material. L, r, and d may be measuredin centimeters (cm), Poisson ration may be about 0.5 for PMDS, andextendability factor (300%) may be measured in Giga Pascals (GPa).

The mechanics of the movement of the electrode posts (e.g., arrays ofposts 101, 102, 104, 202, 204) is a key issue when designing functionalmicro-posts. When a force is applied on the post—considered as abeam—parallel to the initial direction of the unbent post, there is acritical force below which no bending (buckling) occurs. When a force Facts along the entire post length L, perpendicular to the posts, thedeflection Y_(Lz), at a given point L_(z) from the base, is given by:

Y _(Lz) =F(L _(z))³/8EI  Eq. (2)

where E is the bending modulus and I is the moment of inertia. For apost with a circular cross-section of radius r, the moment of inertia isgiven by the relation I=πr⁴/4.

To obtain an estimate for the forces needed to actuate the micro-postusing E=1 GPa, L=8 microns, and r=1.25 microns, to deflect the tip ofthe post by 0.5 microns, one would need a force of about 1.5nano-Newtons (nN). If the same force F is applied only to the tip of thepost, the tip will deflect 2.67 times as far, indicating the ultrasensitivity for use of the array as a pressure sensor that can be usedfor electrical signal generation.

FIG. 6 graphically illustrates the total number of electrodes in a onesquare millimeter area as a function of pitch (distance betweenelectrodes) for three different sizes of electrodes in accordance withone or more embodiments. By decreasing the diameter of themicro-electrodes and the separation distance (pitch) between theelectrodes, as well as increasing the length (and, thus, aspect ratio)of the micro-electrodes, high density of electrodes can be compacted ina 1 mm² substrate. Examples of integration capability for the number ofSi posts is shown in FIG. 6.

FIG. 7 graphically illustrates examples, in accordance with one or moreembodiments, of output voltage for arrays of electrodes as a function ofpitch (distance between electrodes) for three different sizes ofelectrodes. For an array of posts, voltage induced by an application ofa force (stress) can be modeled using an equation as:

V=σ _(x) g _(x)/(2d−2r)  Eq. (3)

where V is the generated voltage, σ_(x) is stress in the x-direction,g_(x) is the piezoelectric coefficient, and d and r are, respectively,the half pitch and the post radius as described above so that (2 d-2 r)is the gap between posts.

When the array (e.g., array of posts 101, 102, 104, 202, or 204) issubjected to ambient vibrations, mechanical stress is induced inside thepiezoelectric layers due to sufficient inertial force provided by theproof mass, which, for example, may be attached to or integral with thesubstrate 106 or 108. At these moments, the piezoelectric layer—e.g.,layer 212 shown in FIG. 2—converts the mechanical strain energy intoelectrical energy and the generated charges are extracted through theposts (electrodes)—e.g. electrodes 202, 204 shown in FIG. 2. Since theoutput voltage is a function of the output charge and the capacitancebetween the posts (electrodes), the output voltage can be adjusted bychanging the distance (2 d) between the electrodes. As the array has themaximum strain at the fixed end, it is clear that the electrode pairclose to the fixed end will generate more charges than the otherelectrode pairs. The generated charges decrease with respect to thedistance to the fixed end of the electrode pairs and the generated opencircuit voltage is the average of that generated by each electrode pairas shown in FIG. 7.

FIG. 8 graphically illustrates examples, in accordance with one or moreembodiments, of total capacitance for a one square millimeter array ofelectrodes as a function of pitch (distance between electrodes) forthree different sizes of electrodes. The effective capacitance of arrayof electrodes having post height L, post radius r, and pitch 2 d can becalculated using Equations 4 and 5 as follows:

Q=V ₀/2Ln(d/r+(d ² /r ²−1)^(1/2))=V ₀/2 cos h ⁻¹(d/r)  Eq. (4)

where Q is the total charge (in Coulumbs); V₀ is voltage between theposts, r is the radius of the posts, and d is the half pitch (i.e., 2 dis the separation distance) between posts.

Given the field (V₀) at the two cylindrical micro-electrode posts (seeFIG. 7), one can compute the effective capacitance as:

C=π∈/cos h ⁻¹(d/r)  Eq. (5)

where C is the total effective capacitance (in Farads), π=3.14159, and ∈is the surrounding material's permittivity: ∈=∈_(r)∈₀ where∈_(r)=relative permittivity and ∈₀=air permittivity, e.g., about8.86×10⁻¹⁴ Farad/cm.

As seen in FIG. 6, on the order of magnitude of 100,000 micro-electrodescan be placed in a 1 mm² area using a 1 micron radius and greater than 2micron separation. Hence, the effective capacitance can approach orderof magnitude near nano-Farad/mm² (substantial increase over prior art)as shown in FIG. 8.

FIGS. 9A, 9B, and 9C depict examples of arrays of micro-electrodes thathave been used for estimation of effective capacitance (e.g., using thesimulation software). The radius-to-separation ratios (e.g., r/d) varyamong the examples shown, affecting capacitance values of the threeelectrode arrays. FIG. 9A shows an array with radius-to-separation ratioof 5/10; FIG. 9B shows an array with radius-to-separation ratio of 1/10;and FIG. 9C shows an array with radius-to-separation ratio of 1/2.1.While value of the capacitance per 1 mm² increases by two orders ofmagnitude (see FIG. 8), FIG. 9 also is an indication of the complexityof the manufacturing process to achieve near 1 nano-Farad per mm², whichis described with reference to FIGS. 10 and 11.

FIGS. 10A, 10B, 10C, 10D illustrate steps in a manufacturing process foran energy harvesting and storage system in accordance with one or moreembodiments. At FIG. 10A, an Si substrate 108 is used to provide anarray of posts 104. The array 104 is used to create a negative replica(not shown) of the Si posts and then used to create a replica 102, 106of the Si array with the piezoelectric material. An importantrequirement is that the negative replica must be able to peel off ordetach easily without disrupting the fine structure of the Si so thatthe features are accurately replicated across a large scale. The PDMS orparaffin mold created has an array of wells, into which the desiredmaterial (e.g., piezoelectric material such as PZT) is cast in liquidform and cured. The mold is then either peeled off or heated anddissolved (paraffin) to reveal the replicated structure 102, 106. Thesesurfaces should exhibit superhydrophobic, self-cleaning properties, andthe water droplets remain suspended on the tips of the array and rolloff the surface, similar to the properties reported for the original Simaster array 104, 108. At FIG. 10B, the original array 104 is “flipped”with respect to the replicated (e.g., piezoelectric array) 102; in otherwords, the two arrays 102, 104 are oriented so that the posts of the twoarrays 102, 104 can be interdigitally interspersed with each other. AtFIG. 10C, the two arrays 102, 104 are aligned so that the posts of thetwo arrays 102, 104 can be interdigitally interspersed with each other,e.g., without collisions between posts of opposing arrays. At FIG. 10D,the two aligned arrays 102, 104 may be brought together and fused orbonded, for example, to form an energy harvesting and storage system 100as seen in FIG. 1.

FIGS. 11A, 11B, 11C, 11D illustrate steps in an alternativemanufacturing process for an energy harvesting and storage system inaccordance with one or more embodiments. The process of FIG. 11 may besimpler with less need for alignment accuracy as well as bonding(fusing) compared to the process of FIG. 10.

At FIG. 11A, Si substrate 206 may be oxidized and then coated with athin layer of nitride 210 to provide a shield against reactive ionetching (RIE) of the substrate 206 to create the array of posts 202.

At FIG. 11B, after processing the array of Si posts 202, the Sisubstrate 206 may be implanted by a high dose of arsenic and annealed toform a continuous cathode layer 207. In an alternative embodiment, acathode 2071 may be formed (e.g., from metal such as gold or aluminum)as a lower plate of substrate 206. Alternatively, layer 206 and posts202 may be formed as an ionizable aqueous layer or may be formed from apolarizable polymer.

For an energy storage unit, the substrate 206 may then be subjected tothermal oxidation to grow the isolation (200 to 500 angstroms) to befollowed by the low pressure chemical vapor deposition (LPCVD) of anisolation layer 212 of nitride (∈_(r)=7) or a high dielectric materialsuch as Ta₂O₅ (∈_(r)=17). For an energy generating unit, as well as amore efficient storage unit, a Si process compatible PZT (∈_(r)>200) asshown in FIG. 11C may be used. Plasma enhanced chemical vapor deposition(PECVD) process may also be used. Another oxidation or dielectricisolation cycle may be performed to ensure the integrity of theisolation layer 212 (transducer oxide in case of generator, or highdielectric insulator for the storage capacitor)

As shown at FIG. 11D, after proper surface cleaning, a layer of dopedpoly silicon 208 may be deposited to form the electrodes 204 filling inthe remaining space around and between the isolation material-coveredposts 202 and forming an anode layer 214. A thin layer of metallization(e.g., aluminum or gold, not shown) may then be sputtered on anode layer214 to enhance the ohmic contacts for the storage capacitor. The samesubstrate 206 can be pre-processed to have the switching devices forregulation of power from the generator to the large storage capacitor.

Embodiments described herein illustrate but do not limit the disclosure.It should also be understood that numerous modifications and variationsare possible in accordance with the principles of the presentdisclosure. Accordingly, the scope of the disclosure is best definedonly by the following claims.

1. An energy harvesting system comprising: an array of piezoelectricelectrodes, wherein the piezoelectric electrodes generate electricalenergy from mechanical displacements of the piezoelectric electrodes;and an array of capacitor electrodes interspersed with the piezoelectricelectrodes, wherein the array of capacitor electrodes stores a portionof the energy generated by the piezoelectric electrodes.
 2. The systemof claim 1, wherein: the array of capacitor electrodes is disposedinterdigitally with the array of piezoelectric electrodes.
 3. The systemof claim 1, wherein: the array of piezoelectric electrodes compriseshigh aspect ratio posts, wherein the aspect ratio of the posts is lowenough to avoid collapse from lateral adhesion forces between the highaspect ratio posts.
 4. The system of claim 3, wherein: the aspect ratioL/2 r is lower than a critical aspect ratio given by the formula:(0.57E^(1/3)(2d)^(1/2))/(γ_(s)(2r)^(1/6)(1−v ²)^(1/12)) wherein r is aradius of a post, L is a height of the post, d is half of a pitchbetween posts, γ_(s) is a surface energy, v is a Poisson ratio of thepost material, and E is an extendability factor of the post material. 5.The system of claim 1, wherein: an area density of electrodes is atleast 400 per square millimeter.
 6. The system of claim 1, furthercomprising: a cathode layer formed in the substrate of the array ofcapacitive electrodes.
 7. The system of claim 1, further comprising: ananode layer of polysilicon deposited on the array of capacitiveelectrodes.
 8. The system of claim 1, wherein: the piezoelectricelectrodes comprise lead zirconate titanate (PZT).
 9. The system ofclaim 1, wherein: a pitch between electrodes is no greater than 50microns.
 10. The system of claim 1, wherein: a diameter of the posts isno greater than 5 microns.
 11. An energy system comprising: a substrateincluding an array of micro-post electrodes connected to a cathode layerof the substrate; an isolation material covering the array of micro-postelectrodes; and an anode layer including electrodes filling theremaining region between the isolation material-covered micro-postelectrodes, wherein the anode layer, electrodes, isolation material,micro-post electrodes, and substrate are monolithically coupled.
 12. Thesystem of claim 11, wherein: the isolation material is a piezoelectricmaterial for functioning as an energy generation system.
 13. The systemof claim 11, wherein: the isolation material is a dielectric materialfor functioning as an energy storage system.
 14. The system of claim 11,wherein: the substrate comprises an ionizable material.
 15. The systemof claim 11, wherein: the substrate comprises silicon implanted witharsenic to form the cathode layer.
 16. The system of claim 11, wherein:the isolation material is a piezoelectric material; and the anode layeris configured to transmit pressure to the piezoelectric material.
 17. Amethod comprising: piezoelectrically converting mechanical strain energyfrom an induced mechanical stress on an array of piezoelectric electrodeposts into electrical energy; and using a geometrical arrangement of anarray of capacitor electrode posts and the array of piezoelectricelectrode posts to capacitively store the electrical energy in the arrayof capacitor electrode posts.
 18. The method of claim 17, furthercomprising: inducing mechanical stress from vibrations of a proof masson the array of piezoelectric electrode posts.
 19. The method of claim17, wherein: the array of capacitor electrode posts is geometricallyarranged with the array of piezoelectric electrode posts interdigitally.20. The method of claim 17, wherein: the array of capacitor electrodeposts is geometrically arranged with the array of piezoelectricelectrode posts by nesting.
 21. The method of claim 17, wherein: avoltage of the stored electrical energy is adjusted in accordance with adetermination of a pitch between the electrodes.
 22. The method of claim17, wherein: an aspect ratio of the piezoelectric electrode posts isdetermined in accordance with avoiding collapse of the posts due toadhesion forces between the posts.
 23. The method of claim 17, wherein:the arrays of electrode posts are formed with an area density of atleast 400 per square millimeter.
 24. A method of manufacturing an energygeneration and storage device, the method comprising: forming an arrayof silicon posts on a substrate; making an elastomeric mold of the arrayof silicon posts having wells corresponding to the posts; casting anarray of piezoelectric electrode posts from the mold; orienting thearray of piezoelectric electrode posts so as to be interdigitallyaligned with the array of silicon posts; and disposing the array ofpiezoelectric electrode posts and the array of silicon posts so as to beinterdigitally arranged with each other.
 25. A method of manufacturingan energy generation and storage device, the method comprising: etchingan array of posts in a silicon substrate using reactive ion etchingprocess; implanting and annealing the silicon substrate to form acathode layer; forming one of either a piezoelectric or a dielectriclayer on the array of posts; and depositing a layer of doped polysiliconon the array of posts to form an anode layer.